Digitimes says VIA will change its packaging procedure for all its Hammer-based products in favour of the lower-cost Ball-Grid Aarray (BGA) process, to reduce the cost of the products. The company will also rename its chipsets to incorporate a sexier-sounding 400 into the labelling mix. Thus the K8HTA, K8HTB and K8UMA chipsets become K8T400, K8T400M and K8M400, respectively.
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http://www.theinquirer.net/?article=4529
Læs mere her:
http://www.theinquirer.net/?article=4529
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