AMD ClawHammer Køler design - Socket 754 Design
Diverse d. 03. november. 2002, skrevet af bruger66666 0 Kommentarer. Vist: 694 gange.
AMD ClawHammer Thermal Design - Socket 754 Design
Rancho*. skriver i dag søndag på Warp2search.net om den kommende Sokel 754:
More commonly now are newsbits about AMD's upcoming 64bit central processing units. It was brought to my attention that they have a tech white paper which describes two different heat sinks and mounting methods for the new CPU.
The new connector for Hammer processors will be called Socket 754. Read more to learn all about the new guidelines about 8th generation cooling.
The heat sink installers do not have to assemble each individual component. The heat sink vendors package the parts with some of the components already assembled. The logical breakdown consists of the components that reside on the topside of the motherboard, the heat sink, and the components that reside on the bottom side of the motherboard, the backplate. Due to the high load required to attach the heat sink to the processor, a backplate is used on the backside of the motherboard to minimize possible warping of the motherboard due to clip forces on the heat sink. requires a screwdriver to install the heat sink. The mechanical advantage of the screw is that it applies a large force to the clip. Minimizing installer fatigue was a significant factor in selecting the use of screws in this thermal solution.
Læs mere her:
http://www.warp2search.net/article.php?sid=8170&mode=&order=0
Rancho*. skriver i dag søndag på Warp2search.net om den kommende Sokel 754:
More commonly now are newsbits about AMD's upcoming 64bit central processing units. It was brought to my attention that they have a tech white paper which describes two different heat sinks and mounting methods for the new CPU.
The new connector for Hammer processors will be called Socket 754. Read more to learn all about the new guidelines about 8th generation cooling.
The heat sink installers do not have to assemble each individual component. The heat sink vendors package the parts with some of the components already assembled. The logical breakdown consists of the components that reside on the topside of the motherboard, the heat sink, and the components that reside on the bottom side of the motherboard, the backplate. Due to the high load required to attach the heat sink to the processor, a backplate is used on the backside of the motherboard to minimize possible warping of the motherboard due to clip forces on the heat sink. requires a screwdriver to install the heat sink. The mechanical advantage of the screw is that it applies a large force to the clip. Minimizing installer fatigue was a significant factor in selecting the use of screws in this thermal solution.
Læs mere her:
http://www.warp2search.net/article.php?sid=8170&mode=&order=0
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