10TB SSD på vej

10TB SSDs på vej

kilde: Intel

Micron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies

NEWS HIGHLIGHTS

• 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity¹ than other NAND die in production.
• Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
• Innovative process architecture techniques extend Moore's Law for flash storage, bringing significant improvements in density while lowering the cost of NAND flash.

The key product features of this 3D NAND design include:

• Large Capacities –Three times the capacity of existing 3D technology¹—up to 48GB of NAND per die—enabling three-fourths of a terabyte to fit in a single
  fingertip-sized package.
   
• Reduced Cost per GB – First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND.
   
• Fast – High read/write bandwidth, I/O speeds and random read performance.
   
• Green – New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
   
• Smart – Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.

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kilde: www.intel.com